GEMINI® Automated Production Wafer Bonder
- Any type of wafer bonding technology applied in the industry in the same chamber
(any direct and intermediate type of bonding)
- Changeover time between different bond types < 30min
- Tool hangeover between different wafer sizes within 15min
- EVG500 chambers can be prepared to perform Hot Embossing (Thermal Nanoimprinting)
including automated de-embossing of stamp and substrate
- EVG520IS dual chamber design allows for performing bonds with different cleanliness levels
(e.g. Si Direct bonding in metal-ion free chamber and Epoxy bonding in second chamber)
and different sizes (second chamber can be upgraded later in the field)
- GEMINI and EVG800 Series can be upgraded with additional modules
(e.g. coating and cleaning chambers, low temperature plasma activation chambers,
additional bond chambers, etc.) later in the field
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EV Group's capabilities that contribute to the lowest TCO of wafer bonding in the
market:
Looking at today's MEMS market & technology portfolio it is evident that finding
a sweet spot in the market with only a single product is getting more and more challenging.
Production tools that provide investment protection and thus being able to serve many
different device processing needs can provide you with the necessary flexibility.
- Only low force wedge compensation on the market that is applied for every wafer pair before applying high force
- Temperature Uniformity of top and bottom side heater ± 1%
- High Vacuum Capability: e-5 mbar
- Pressure Uniformity: ± 5%
- Additional compliant layers for dedicated bonding methods can bring down pressure uniformities to ± 1%
- High Pressure Capability up to 60kN (~ 20bar on a 200mm wafer)
- Bond Chucks with solid Inserts, having superior flatness and TTV values and prevent cross contamination between different chambers resp.
between Aligner and Bonder
- Intelligent Wafer clamping mechanism after alignment to suppress any wafer shift and to guarantee superior post-bond alignment accuracy
down to < 1µm@3s)
- Separation Flags with lowest friction guarantee no wafer breakage
- Clamped Wafer Stack is not flipped over between SmartView Aligner and Bond Chamber in the GEMINI system, thus introducing no wafer shift
- External Cooling Station on EVG500 Series is doubling throughput compared to competitive systems
- Independently controllable Heating and Cooling Ramps on top and bottom side: 45°C/min
- High Volume proven integrated equipment platforms (GEMINI, EVG800 Series) capable for throughputs over 20 WPH incorporating
multiple bond chambers (up to 4 for GEMINI) and fast SmartView® alignment principle
- SECSII compatibility for all wafer bonding platforms
- Remote Control Ability for fastest failure analysis from EVG specialists
GEMINI® Automated Production Wafer Bonder
Our customers are aware of the fact that the cost of the wafer bonding tool over the
total lifetime is depending on many different factors. Instead of considering only the
capital investment costs of the machine with a given technological capability and deriving
the operational time to break even (ROI) for our customers, EV Group is additionally emphasizing on
reducing every cost factor that is going to contribute to the Total Cost of Ownership (TCO) of the
tool.
EV Group (EVG)
is a world leader in wafer-processing solutions
for semiconductor, MEMS and nanotechnology applications.
Through its flexible manufacturing model, EVG develops
reliable, high-quality, low-cost-of-ownership systems that
are easily integrated into customer's fab lines. Key
products include wafer bonding, lithography/nanoimprint
lithography (NIL), metrology, photoresist coating, cleaning
and inspection equipment.
Invent
there are no limits; only limiting thoughts
Solutions for the semiconductor and related microelectronics industries. |
