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GEMINI® fully automated bond cluster for 3D accelerometer manufacturing
(courtesy of ST Microelectronics)
EV Group was the pioneer in equipment solutions for MEMS more than 25 years ago with introducing
double side alignment capability on Mask Aligners. Already in 1990 EVG launched the first
wafer bonding systems and led the MEMS industry since these days.
Meanwhile EV Group is leading the MEMS industry since these days diversified into other
fast growing markets like SOI, Nanoimprinting, Compound Semiconductor, Advanced Packaging and
3D Integration. Still MEMS is the core business of EVG and wafer bonding technology was
successfully
leveraged for all other markets that EVG is doing business in.
EV Group gained the wafer bonding expertise of a pioneer in those diversified markets and
thus is able to lead again in manufacturing equipment for emerging MEMS markets like
3D Integrated MEMS on CMOS, true wafer level packaged MEMS or NEMS (Nano-Electro-Mechanical-Systems).
EV Group (EVG)
is a world leader in wafer-processing solutions
for semiconductor, MEMS and nanotechnology applications.
Through its flexible manufacturing model, EVG develops
reliable, high-quality, low-cost-of-ownership systems that
are easily integrated into customer's fab lines. Key
products include wafer bonding, lithography/nanoimprint
lithography (NIL), metrology, photoresist coating, cleaning
and inspection equipment.
Invent
there are no limits; only limiting thoughts
Solutions for the semiconductor and related microelectronics industries. |
